HX8N0 series of fully automated probe station equipment is professional to deal with 8-inch wafer-level performance testing of various devices, can be for different wafer testing, can be equipped with the appropriate instrumentation, I-V, C-V, optical signals, and other characteristics of the analysis, the equipment has a rich set of features to match a variety of test application environment, can be upgraded to high-power wafer testing, RF testing, fully automated testing and can be loaded with a temperature-control system, to meet the needs of customers in the High and low temperature environment of various wafer device performance testing needs.

Features:
- Space saving;
- Full closed-loop linear motor motion control;
- High precision and testing speed, greatly improving the testing efficiency;
- Meet high voltage and high current testing;
- Upgradeable automatic wafer thickness measurement and ID card reading.

Software function introduction
- Can test discs, test range is optional, support interlaced sampling and ring test, MAP chart can be edited test;
- Support bad point retest;
- With offline punching point, synchronous punching point function;
- With contact buffer function, needle mark stability;
- Running feedback function to ensure the stability of the test;
- Test yield, total number, speed display;
- CCD image automatic alignment and positioning;
- CCD automatic needle alignment function;
- With automatic needle clearing and grinding function;
- With certain anti-interference ability;
- Multi-BIN classification test, test data can be stored, can be exported, compatible with the use of back-channel equipment format, with statistical analysis of data;
- Operator, administrator, system manufacturer rights management function;
- Support TTL, 232, GPIB and other common protocols.