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Temporary Grease

Temporary Grease

Temporary Grease

Temporary Grease Overview

Parameters and indicators:

Technical indicators
Apiezon® N:
Apiezon® H: 
Melting point303 K (30 °C)513 K (240 °C)
Thermal conductivity
1 K (-272 °C)
0.02 W/(m • K)
4.2 K (-269 °C)
0.095 W/(m • K)

100 K (-173 °C)
0.11 W/(m • K)

300 K (27 °C)
0.19 W/(m • K)
0.22 W/(m • K)
Coefficient of thermal expansion (K-1)
0.00072
0.00072
Bulk resistivity
2 × 1016 Ω • m
4.6 × 1013 Ω • m
Vapor pressure @ 293 K (20 °C):
2.27 × 10-7 Pa;(1.7 × 10-9 Torr)
2.27 × 10-7 Pa;(1.7 × 10-9 Torr)
Release air
TML: <1%;CVCM: <0.1%
TML: <1%;CVCM: <0.1%


Temporary Grease Technical Parameter

Temporary Grease Basic Configuration

Semiconductor
IC
Wafer

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