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HX510 Series

HX510 Series

HX510 series fully automatic probe table is a professional comprehensive and efficient fully automatic automatic wafer probe table, with space-saving, high-efficiency features, suitable for 4-inch, 5-inch wafers, including diodes, transistors, MOSFET tubes, photovoltaic devices, sensors, and the vertical structure of the measurement of the chip, can be equipped with an optional multi-needle test function, you can achieve the requirements of the simultaneous measurement of multiple pieces of the machine to increase the capacity of the test.

HX510 Series Overview

  HX510 series fully automatic probe table is a professional comprehensive and efficient fully automatic automatic wafer probe table, with space-saving, high-efficiency features, suitable for 4-inch, 5-inch wafers, including diodes, transistors, MOSFET tubes, photovoltaic devices, sensors, and the vertical structure of the measurement of the chip, can be equipped with an optional multi-needle test function, you can achieve the requirements of the simultaneous measurement of multiple pieces of the machine to increase the capacity of the test.


Features:
Applicable to high-speed automatic testing of wafers, support for multi-channel test functions, a variety of flexible test methods and rich data processing capabilities. Can achieve automatic scanning, alignment and positioning functions. The product can also be customised according to different needs to develop a variety of additional functions. The structure adopts a full-automatic and semi-automatic collocation and become, full-automatic probe table can also be used alone, with automatic up and down the chip function, at the same time, the back of the wafer boat to be tested wafer boat buffer, support for the test workshop automation, automatic loading of the wafer boat, can achieve the test workshop unmanned.


Software function introduction
1. Can test round piece, test range can be selected, support interlaced sampling and ring test, MAP chart can be edited test;
2. Support bad point retest;
3. With offline punching, synchronous punching function;
4. With contact buffer function, needle mark stability;
5. Running accuracy compensation function to ensure the stability of the test;
6. Test yield, total number, speed display;
7. CCD image automatic alignment and positioning;
8. The equipment has a certain anti-interference ability, support high and low temperature testing, stable operation;
9. Multi-BIN classification test, test data can be stored, can be exported, compatible with the use of back-channel equipment format, with data statistical analysis function;
10. Operator, administrator, system manufacturer rights management function;

HX510 Series Technical Parameter

Parameters and indicators:

Performance nameTechnical indicators
The wafer size can be tested3 inches, 4 inches, 5 inches
Workbench stroke140mm×150mm
Control accuracy≤0.001mm
Full precision≤±0.05mm/160mm
Z-direction travel≤5mm(adjustable)
θ-direction adjustable range±15°
Support high-voltage testing≥2000V
Reprinted from JingzhouvDouble Crystal boat
Vacuum degree>-0.08MP
Power supplyAC220V 50Hz,1KW



HX510 Series Basic Configuration

Semiconductor
IC
Wafer

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