HX50N series semi-automatic probe table is suitable for 4-inch, 5-inch wafers, including diodes, transistors, MOSFET tubes, vertical structure of the chip measurement, especially suitable for warped wafers and high-voltage chip testing, optional multi-needle test function, can achieve multiple simultaneous measurement of the requirements of the machine to improve the test capacity.

Software function introduction:
1. Can test the wafer, the test range can be selected, support for interlaced sampling and ring test, MAP map can be edited test;
2. Support bad point retest;
3. With offline punching and synchronous punching functions;
4. With contact buffer function, needle mark stability;
5. Running accuracy compensation function to ensure the stability of the test;
6. Test yield, total number, speed display;
7. CCD image automatic alignment and positioning;
8. The equipment has a certain anti-interference ability, support high and low temperature testing, stable operation;
9. Multi-BIN classification test, test data can be stored, can be exported, compatible with the use of back-channel equipment format, with data statistical analysis function;
10. Operator, administrator, system manufacturer rights management function;

Parameters and indicators：