Liquid nitrogen high and low temperature probe table plays a vital role in scientific research and technology development. It can carry out various non-destructive physical and electrical property tests on samples in a low-temperature environment to help researchers gain a deeper understanding of the various physical and electrical properties of materials or devices, thus providing important data support for the research and development and application of new materials.

  PSM-LN2 series liquid nitrogen high and low temperature probe stage can provide an 80K-800K high and low temperature vacuum test environment for the electrical parameter test of semiconductor chips. By connecting different electrical measurement instruments, it can complete the parameter test of voltage, current, resistance and IV curve of integrated circuits, which can be used for the non-destructive electrical test of chips, wafers and devices under the low-temperature vacuum environment.

Features:
- Liquid Nitrogen High/Low Temperature Vacuum Probe Stage, the vacuum level of the chamber can reach 10E-4torr in 15 minutes, the liquid nitrogen consumption is small, only 0.2L liquid nitrogen is needed to lower the temperature, it is convenient to use and economical at the same time.
- The displacement adjustment of the probe arm is operated outside the vacuum chamber, allowing different devices on the sample to be switched for testing without destroying the vacuum.
- The unique four-dimensional X-Y-Z-R adjustment of the probe arm allows testing of up to 4-inch samples.
- The vacuum chamber is made of aluminium, which effectively reduces external electromagnetic interference and improves test accuracy and stability.
- The probe arm adopts tri-coaxial connector, good leakage performance, the measured leakage current is less than 100fA @1V@80K--800K.
- Wide test temperature range, support 80K-800K continuous temperature change.
- Uniquely designed flexible probe, the probe is mounted on the copper shrapnel, to avoid excessive force during the pinning process leading to sample or electrode damage.
- The upper cover adopts flip cover structure, more convenient to change samples.